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Huawei / 华为 announced plan ↓ Ascend 950, 960 and 970 chip series Eric Xu stated, in Huawei’s published keynote transcript, at Huawei Connect on 18 September 2025 that over the next three years Huawei would work on three new Ascend chip series (950, 960 and 970), with the Ascend 950PR to be available in the first quarter of 2026, the 950DT in the fourth quarter of 2026, the 960 in the fourth quarter of 2027 and the 970 planned for the fourth quarter of 2028. Copy claim link
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Machine-checked, not reviewed by an editor Stated in source Supported
Supporting evidence: primary · 1 source
Date 2025-09-18 · announcement Stated dates (targets and terms, not events) launch target: Q1 2026; launch target: Q4 2026; launch target: Q4 2027; launch target: Q4 2028 Scope and limits A product roadmap with target dates; it does not show that any chip was produced or shipped, where it is manufactured, or in what volume. The speaker’s office at Huawei is not stated in the retrieved transcript and is not recorded.
The evidence 05 primary source Supports the claim
Groundbreaking SuperPoD Interconnect: Leading a New Paradigm for AI Infrastructure (Keynote Speech by Eric Xu at Huawei Connect 2025) ↗ Huawei · 2025-09-18
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Source excerpt “Over the next three years, we'll be working on three new series of Ascend chips: the Ascend 950 series, which includes the Ascend 950PR and the Ascend 950DT, the Ascend 960 series, and the Ascend 970 series.” Location in source keynote, Ascend roadmap section
How it was read Retrieved directly from the publisher
Machine-checked · 2026-10-30
Source details and check notes Authors Huawei Version Retrieved for the candidate pack on 2026-10-28 (SHA-256 e5fc9ed3d80656be05a1619a81cdcedc53ffca3bb43db30d62c48354caf26789). Huawei English newsroom transcript as served on 2026-10-28; headed "[Shanghai, China, September 18, 2025]". English is the language of the served transcript; whether it is a translation of a Chinese delivery is not stated. Retrieved again at admission on 2026-10-30 (SHA-256 bb42aed499ea91c715e7f5e53e0d4c7262f1b4c388fdf141b982e58e32f3161d). Its wording can change; earlier wording is not authenticated. Canonical address Open the canonical source ↗ Accessed 2026-10-28 Language English (en) Attribution Huawei, “Groundbreaking SuperPoD Interconnect: Leading a New Paradigm for AI Infrastructure (Keynote Speech by Eric Xu at Huawei Connect 2025)”, 2025-09-18. Reuse No open redistribution licence asserted. Bibliographic metadata, editorial paraphrases and short attributed quotations (at most 50 words each). Recheck terms before wider redistribution. Check notes Candidate pack passage, compute, power and orbit (research/compute-power-orbit). The quotation (37 words) matched the text retrieved for the candidate pack on 2026-10-28 and again at admission on 2026-10-30, in a fresh retrieval (SHA-256 bb42aed499ea91c715e7f5e53e0d4c7262f1b4c388fdf141b982e58e32f3161d; the bytes differ from the pack’s retrieval). Matching ignored differences of whitespace, case, quotation marks, dashes and Unicode compatibility forms, so the source’s typography can differ. No human editorial review. primary source Supports the claim
Groundbreaking SuperPoD Interconnect: Leading a New Paradigm for AI Infrastructure (Keynote Speech by Eric Xu at Huawei Connect 2025) ↗ Huawei · 2025-09-18
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Source excerpt “This chip will be available in the first quarter of 2026.” Location in source keynote, Ascend 950PR
How it was read Retrieved directly from the publisher
Machine-checked · 2026-10-30
Source details and check notes Authors Huawei Version Retrieved for the candidate pack on 2026-10-28 (SHA-256 e5fc9ed3d80656be05a1619a81cdcedc53ffca3bb43db30d62c48354caf26789). Huawei English newsroom transcript as served on 2026-10-28; headed "[Shanghai, China, September 18, 2025]". English is the language of the served transcript; whether it is a translation of a Chinese delivery is not stated. Retrieved again at admission on 2026-10-30 (SHA-256 bb42aed499ea91c715e7f5e53e0d4c7262f1b4c388fdf141b982e58e32f3161d). Its wording can change; earlier wording is not authenticated. Canonical address Open the canonical source ↗ Accessed 2026-10-28 Language English (en) Attribution Huawei, “Groundbreaking SuperPoD Interconnect: Leading a New Paradigm for AI Infrastructure (Keynote Speech by Eric Xu at Huawei Connect 2025)”, 2025-09-18. Reuse No open redistribution licence asserted. Bibliographic metadata, editorial paraphrases and short attributed quotations (at most 50 words each). Recheck terms before wider redistribution. Check notes Candidate pack passage, compute, power and orbit (research/compute-power-orbit). The quotation (11 words) matched the text retrieved for the candidate pack on 2026-10-28 and again at admission on 2026-10-30, in a fresh retrieval (SHA-256 bb42aed499ea91c715e7f5e53e0d4c7262f1b4c388fdf141b982e58e32f3161d; the bytes differ from the pack’s retrieval). Matching ignored differences of whitespace, case, quotation marks, dashes and Unicode compatibility forms, so the source’s typography can differ. No human editorial review. primary source Supports the claim
Groundbreaking SuperPoD Interconnect: Leading a New Paradigm for AI Infrastructure (Keynote Speech by Eric Xu at Huawei Connect 2025) ↗ Huawei · 2025-09-18
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Source excerpt “The Ascend 950DT chip will be available in the fourth quarter of 2026.” Location in source keynote, Ascend 950DT
How it was read Retrieved directly from the publisher
Machine-checked · 2026-10-30
Source details and check notes Authors Huawei Version Retrieved for the candidate pack on 2026-10-28 (SHA-256 e5fc9ed3d80656be05a1619a81cdcedc53ffca3bb43db30d62c48354caf26789). Huawei English newsroom transcript as served on 2026-10-28; headed "[Shanghai, China, September 18, 2025]". English is the language of the served transcript; whether it is a translation of a Chinese delivery is not stated. Retrieved again at admission on 2026-10-30 (SHA-256 bb42aed499ea91c715e7f5e53e0d4c7262f1b4c388fdf141b982e58e32f3161d). Its wording can change; earlier wording is not authenticated. Canonical address Open the canonical source ↗ Accessed 2026-10-28 Language English (en) Attribution Huawei, “Groundbreaking SuperPoD Interconnect: Leading a New Paradigm for AI Infrastructure (Keynote Speech by Eric Xu at Huawei Connect 2025)”, 2025-09-18. Reuse No open redistribution licence asserted. Bibliographic metadata, editorial paraphrases and short attributed quotations (at most 50 words each). Recheck terms before wider redistribution. Check notes Candidate pack passage, compute, power and orbit (research/compute-power-orbit). The quotation (13 words) matched the text retrieved for the candidate pack on 2026-10-28 and again at admission on 2026-10-30, in a fresh retrieval (SHA-256 bb42aed499ea91c715e7f5e53e0d4c7262f1b4c388fdf141b982e58e32f3161d; the bytes differ from the pack’s retrieval). Matching ignored differences of whitespace, case, quotation marks, dashes and Unicode compatibility forms, so the source’s typography can differ. No human editorial review. primary source Supports the claim
Groundbreaking SuperPoD Interconnect: Leading a New Paradigm for AI Infrastructure (Keynote Speech by Eric Xu at Huawei Connect 2025) ↗ Huawei · 2025-09-18
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Source excerpt “The Ascend 960 chip will be available in the fourth quarter of 2027.” Location in source keynote, Ascend 960
How it was read Retrieved directly from the publisher
Machine-checked · 2026-10-30
Source details and check notes Authors Huawei Version Retrieved for the candidate pack on 2026-10-28 (SHA-256 e5fc9ed3d80656be05a1619a81cdcedc53ffca3bb43db30d62c48354caf26789). Huawei English newsroom transcript as served on 2026-10-28; headed "[Shanghai, China, September 18, 2025]". English is the language of the served transcript; whether it is a translation of a Chinese delivery is not stated. Retrieved again at admission on 2026-10-30 (SHA-256 bb42aed499ea91c715e7f5e53e0d4c7262f1b4c388fdf141b982e58e32f3161d). Its wording can change; earlier wording is not authenticated. Canonical address Open the canonical source ↗ Accessed 2026-10-28 Language English (en) Attribution Huawei, “Groundbreaking SuperPoD Interconnect: Leading a New Paradigm for AI Infrastructure (Keynote Speech by Eric Xu at Huawei Connect 2025)”, 2025-09-18. Reuse No open redistribution licence asserted. Bibliographic metadata, editorial paraphrases and short attributed quotations (at most 50 words each). Recheck terms before wider redistribution. Check notes Candidate pack passage, compute, power and orbit (research/compute-power-orbit). The quotation (13 words) matched the text retrieved for the candidate pack on 2026-10-28 and again at admission on 2026-10-30, in a fresh retrieval (SHA-256 bb42aed499ea91c715e7f5e53e0d4c7262f1b4c388fdf141b982e58e32f3161d; the bytes differ from the pack’s retrieval). Matching ignored differences of whitespace, case, quotation marks, dashes and Unicode compatibility forms, so the source’s typography can differ. No human editorial review. primary source Supports the claim
Groundbreaking SuperPoD Interconnect: Leading a New Paradigm for AI Infrastructure (Keynote Speech by Eric Xu at Huawei Connect 2025) ↗ Huawei · 2025-09-18
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Source excerpt “The plan is to go to market with the Ascend 970 in the fourth quarter of 2028.” Location in source keynote, Ascend 970
How it was read Retrieved directly from the publisher
Machine-checked · 2026-10-30
Source details and check notes Authors Huawei Version Retrieved for the candidate pack on 2026-10-28 (SHA-256 e5fc9ed3d80656be05a1619a81cdcedc53ffca3bb43db30d62c48354caf26789). Huawei English newsroom transcript as served on 2026-10-28; headed "[Shanghai, China, September 18, 2025]". English is the language of the served transcript; whether it is a translation of a Chinese delivery is not stated. Retrieved again at admission on 2026-10-30 (SHA-256 bb42aed499ea91c715e7f5e53e0d4c7262f1b4c388fdf141b982e58e32f3161d). Its wording can change; earlier wording is not authenticated. Canonical address Open the canonical source ↗ Accessed 2026-10-28 Language English (en) Attribution Huawei, “Groundbreaking SuperPoD Interconnect: Leading a New Paradigm for AI Infrastructure (Keynote Speech by Eric Xu at Huawei Connect 2025)”, 2025-09-18. Reuse No open redistribution licence asserted. Bibliographic metadata, editorial paraphrases and short attributed quotations (at most 50 words each). Recheck terms before wider redistribution. Check notes Candidate pack passage, compute, power and orbit (research/compute-power-orbit). The quotation (17 words) matched the text retrieved for the candidate pack on 2026-10-28 and again at admission on 2026-10-30, in a fresh retrieval (SHA-256 bb42aed499ea91c715e7f5e53e0d4c7262f1b4c388fdf141b982e58e32f3161d; the bytes differ from the pack’s retrieval). Matching ignored differences of whitespace, case, quotation marks, dashes and Unicode compatibility forms, so the source’s typography can differ. No human editorial review. Status and meaning Editorial status. Not reviewed by an editor . An exploratory record that no editor has accepted. This status does not say whether a person has read any linked passage. Each evidence record above shows how it was checked.
Relation. A party announced a plan, programme or intention, dated by the announcement. A plan is not an action, a contract or spending.
Date. Date line of the keynote transcript.
Record ID cpo-ch-huawei-ascend-roadmap