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President Biden’s statement of 8 April 2024 said the Department of Commerce was announcing a preliminary agreement with TSMC to support the construction of leading-edge semiconductor manufacturing facilities in the United States, and that TSMC would also build a third chip factory in Phoenix, increasing its total investment in Arizona to $65 billion. Copy claim link
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Machine-checked, not reviewed by an editor Stated in source Supported
Supporting evidence: primary · 2 sources; Context: primary · 1 source
Date 2024-04-08 · announcement Scope and limits A preliminary agreement; the total award amount is not stated in this statement (it mentions $50 million of CHIPS funding for workforce training). The $65 billion is TSMC’s stated total Arizona investment, not the award. The statement names Taiwan Semiconductor Manufacturing Company; TSMC Arizona is named as awardee in the final award release. The statement does not mention AI; the AI reference appears in the final award release (recorded separately).
The evidence 05 primary source Supports the claim
Statement on the Preliminary Funding Agreement Between the Department of Commerce and Taiwan Semiconductor Manufacturing Company Under the CHIPS and Science Act (DCPD-202400273) ↗ Office of the Federal Register, Compilation of Presidential Documents (govinfo.gov) · 2024-04-08
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Source excerpt “Department of Commerce announcing a preliminary agreement with Taiwan Semiconductor Manufacturing Company (TSMC)” Location in source paragraph 2
How it was read Retrieved directly from the publisher
Machine-checked · 2026-10-30
Source details and check notes Authors Office of the Federal Register, Compilation of Presidential Documents (govinfo.gov) Version Retrieved for the candidate pack on 2026-10-28 (SHA-256 637ca077db2c4d253f79f85319327e4acf5a472fd03079f478c687d74cd19f5b). Daily Compilation of Presidential Documents entry DCPD202400273, statement dated April 8, 2024, as served by govinfo.gov on 2026-10-28. Retrieved again at admission on 2026-10-30 (SHA-256 637ca077db2c4d253f79f85319327e4acf5a472fd03079f478c687d74cd19f5b, the same bytes). Canonical address Open the canonical source ↗ Accessed 2026-10-28 Language English (en) Attribution Office of the Federal Register, Compilation of Presidential Documents (govinfo.gov), “Statement on the Preliminary Funding Agreement Between the Department of Commerce and Taiwan Semiconductor Manufacturing Company Under the CHIPS and Science Act (DCPD-202400273)”, 2024-04-08. Reuse No open redistribution licence asserted. Bibliographic metadata, editorial paraphrases and short attributed quotations (at most 50 words each). Recheck terms before wider redistribution. Check notes Candidate pack passage, compute, power and orbit (research/compute-power-orbit). The quotation (13 words) matched the text retrieved for the candidate pack on 2026-10-28 and again at admission on 2026-10-30, in a fresh retrieval whose SHA-256 equals the pack’s. Matching ignored differences of whitespace, case, quotation marks, dashes and Unicode compatibility forms, so the source’s typography can differ. No human editorial review. primary source Supports the claim
Statement on the Preliminary Funding Agreement Between the Department of Commerce and Taiwan Semiconductor Manufacturing Company Under the CHIPS and Science Act (DCPD-202400273) ↗ Office of the Federal Register, Compilation of Presidential Documents (govinfo.gov) · 2024-04-08
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Paraphrase the preliminary agreement is to support the construction of leading-edge semiconductor manufacturing facilities in the United States.
Location in source paragraph 2
How it was read Retrieved directly from the publisher
Machine-checked · 2026-10-30
Source details and check notes Authors Office of the Federal Register, Compilation of Presidential Documents (govinfo.gov) Version Retrieved for the candidate pack on 2026-10-28 (SHA-256 637ca077db2c4d253f79f85319327e4acf5a472fd03079f478c687d74cd19f5b). Daily Compilation of Presidential Documents entry DCPD202400273, statement dated April 8, 2024, as served by govinfo.gov on 2026-10-28. Retrieved again at admission on 2026-10-30 (SHA-256 637ca077db2c4d253f79f85319327e4acf5a472fd03079f478c687d74cd19f5b, the same bytes). Canonical address Open the canonical source ↗ Accessed 2026-10-28 Language English (en) Attribution Office of the Federal Register, Compilation of Presidential Documents (govinfo.gov), “Statement on the Preliminary Funding Agreement Between the Department of Commerce and Taiwan Semiconductor Manufacturing Company Under the CHIPS and Science Act (DCPD-202400273)”, 2024-04-08. Reuse No open redistribution licence asserted. Bibliographic metadata, editorial paraphrases and short attributed quotations (at most 50 words each). Recheck terms before wider redistribution. Check notes Candidate pack passage, compute, power and orbit (research/compute-power-orbit). The paraphrase is Selekoa’s, written from the text retrieved for the candidate pack on 2026-10-28; it is not a quotation and was not machine-matched. The cross-family check found it faithful. No human editorial review. primary source Supports the claim
Statement on the Preliminary Funding Agreement Between the Department of Commerce and Taiwan Semiconductor Manufacturing Company Under the CHIPS and Science Act (DCPD-202400273) ↗ Office of the Federal Register, Compilation of Presidential Documents (govinfo.gov) · 2024-04-08
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Source excerpt “TSMC will also build a third chip factory in Phoenix, increasing its total investment in Arizona to $65 billion” Location in source paragraph 2
How it was read Retrieved directly from the publisher
Machine-checked · 2026-10-30
Source details and check notes Authors Office of the Federal Register, Compilation of Presidential Documents (govinfo.gov) Version Retrieved for the candidate pack on 2026-10-28 (SHA-256 637ca077db2c4d253f79f85319327e4acf5a472fd03079f478c687d74cd19f5b). Daily Compilation of Presidential Documents entry DCPD202400273, statement dated April 8, 2024, as served by govinfo.gov on 2026-10-28. Retrieved again at admission on 2026-10-30 (SHA-256 637ca077db2c4d253f79f85319327e4acf5a472fd03079f478c687d74cd19f5b, the same bytes). Canonical address Open the canonical source ↗ Accessed 2026-10-28 Language English (en) Attribution Office of the Federal Register, Compilation of Presidential Documents (govinfo.gov), “Statement on the Preliminary Funding Agreement Between the Department of Commerce and Taiwan Semiconductor Manufacturing Company Under the CHIPS and Science Act (DCPD-202400273)”, 2024-04-08. Reuse No open redistribution licence asserted. Bibliographic metadata, editorial paraphrases and short attributed quotations (at most 50 words each). Recheck terms before wider redistribution. Check notes Candidate pack passage, compute, power and orbit (research/compute-power-orbit). The quotation (19 words) matched the text retrieved for the candidate pack on 2026-10-28 and again at admission on 2026-10-30, in a fresh retrieval whose SHA-256 equals the pack’s. Matching ignored differences of whitespace, case, quotation marks, dashes and Unicode compatibility forms, so the source’s typography can differ. No human editorial review. primary source Context only
Statement on the Preliminary Funding Agreement Between the Department of Commerce and Taiwan Semiconductor Manufacturing Company Under the CHIPS and Science Act (DCPD-202400273) ↗ Office of the Federal Register, Compilation of Presidential Documents (govinfo.gov) · 2024-04-08
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Paraphrase the agreement also dedicates $50 million of CHIPS funding to training and developing the local workforce.
Location in source paragraph 2
How it was read Retrieved directly from the publisher
Machine-checked · 2026-10-30
Source details and check notes Authors Office of the Federal Register, Compilation of Presidential Documents (govinfo.gov) Version Retrieved for the candidate pack on 2026-10-28 (SHA-256 637ca077db2c4d253f79f85319327e4acf5a472fd03079f478c687d74cd19f5b). Daily Compilation of Presidential Documents entry DCPD202400273, statement dated April 8, 2024, as served by govinfo.gov on 2026-10-28. Retrieved again at admission on 2026-10-30 (SHA-256 637ca077db2c4d253f79f85319327e4acf5a472fd03079f478c687d74cd19f5b, the same bytes). Canonical address Open the canonical source ↗ Accessed 2026-10-28 Language English (en) Attribution Office of the Federal Register, Compilation of Presidential Documents (govinfo.gov), “Statement on the Preliminary Funding Agreement Between the Department of Commerce and Taiwan Semiconductor Manufacturing Company Under the CHIPS and Science Act (DCPD-202400273)”, 2024-04-08. Reuse No open redistribution licence asserted. Bibliographic metadata, editorial paraphrases and short attributed quotations (at most 50 words each). Recheck terms before wider redistribution. Check notes Candidate pack passage, compute, power and orbit (research/compute-power-orbit). The paraphrase is Selekoa’s, written from the text retrieved for the candidate pack on 2026-10-28; it is not a quotation and was not machine-matched. The cross-family check found it faithful. No human editorial review. primary source Supports the claim
Biden-Harris Administration Announces CHIPS Incentives Award with TSMC Arizona to Secure U.S. Leadership in Advanced Semiconductor Technology ↗ National Institute of Standards and Technology (CHIPS for America), U.S. Department of Commerce · 2024-11-15
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Source excerpt “previously signed preliminary memorandum of terms, announced on April 8, 2024” Location in source paragraph 1
How it was read Retrieved directly from the publisher
Machine-checked · 2026-10-30
Source details and check notes Authors National Institute of Standards and Technology (CHIPS for America), U.S. Department of Commerce Version Retrieved for the candidate pack on 2026-10-28 (SHA-256 9c5f8c012189d135c3cd9fc13e28f5c13960a8d740f452cb0f58ae5d94e8f12b). NIST news page as served on 2026-10-28; it states "Released November 15, 2024, Updated October 6, 2025". The served text may differ from the text first released; the checker should compare a near-release capture. The commerce.gov copy refuses direct retrieval. Retrieved again at admission on 2026-10-30 (SHA-256 2ca428ef7b1833071d776f2fc88e08c5bc09dd8655b41978e5b2d1b1db07ee04). Canonical address Open the canonical source ↗ Accessed 2026-10-28 Language English (en) Attribution National Institute of Standards and Technology (CHIPS for America), U.S. Department of Commerce, “Biden-Harris Administration Announces CHIPS Incentives Award with TSMC Arizona to Secure U.S. Leadership in Advanced Semiconductor Technology”, 2024-11-15. Reuse No open redistribution licence asserted. Bibliographic metadata, editorial paraphrases and short attributed quotations (at most 50 words each). Recheck terms before wider redistribution. Check notes Candidate pack passage, compute, power and orbit (research/compute-power-orbit). The quotation (11 words) matched the text retrieved for the candidate pack on 2026-10-28 and again at admission on 2026-10-30, in a fresh retrieval (SHA-256 2ca428ef7b1833071d776f2fc88e08c5bc09dd8655b41978e5b2d1b1db07ee04; the bytes differ from the pack’s retrieval). Matching ignored differences of whitespace, case, quotation marks, dashes and Unicode compatibility forms, so the source’s typography can differ. No human editorial review. Status and meaning Editorial status. Not reviewed by an editor . An exploratory record that no editor has accepted. This status does not say whether a person has read any linked passage. Each evidence record above shows how it was checked.
Relation. A public body states an award, grant or selection, with its stage: preliminary, final or disbursed. A preliminary award is not a final one, and a final award is not disbursement.
Date. Date of the presidential statement; NIST later dates the preliminary memorandum of terms to an announcement of 8 April 2024.
Record ID cpo-ch-tsmc-chips-preliminary